Mar 23 2009
Asus has released the new X58-based ROG (Republic of Gamers) Rampage II GENE in response to demand for a mini form factor (mATX) gaming motherboard.
The Rampage II GENE boasts premium features such as MemOK! for worry-free memory upgrades, CPU Level Up for easy system performance boosts, and onboard SupremeFX X-Fi for true-to-life surround sound 
Mar 21 2009
DMP Electronics’ E-Box 4310 carries a small physical footprint and weights around 500grams and is one of the smallest portable PCs you can find in town. 
CPU
VIA Eden ULV 500Mhz
Chipset
VIA CX700M
System Memory
512 or 1GB DDR2 version
I/O
EIDE, PS/2 Key Board / Mouse PS / 2 , Type I/II CF slot RS- 232 Port (Opt. for eBox-4300JSK) 3x USB 2.0 slots
Display
Integrated VIA UniChrome 2D/3D Graphics with MPEG4 / WMV9 decoding accelerator up to 128 MB share system memory Resolution up to 1920×1440
Network
Realtek 8100B 10/100 Base-T Built-in boot ROM function, support PXE boot and Wake-up on LAN
With a TDP around 1W, heat issue is minimal and its portability allows you to carry it around with ease and hook up to a monitor.
Mar 05 2009
WiFi is known as the 802.11 wireless standard. There are a number of sub-series such as the 802.11(a) (b) or (g). The subsequent generations of this technology have increased the speed and range. Its most common use is to provide wireless Internet to users of notebook computers. However, even with the advances in WiFi, there are a number of limitations.
WiFi has some inherent disadvantages. For example, while WiFi can work good in localized locations, the routers used for the connections do not have a tremendous amount of range. In most cases, 300 feet (approximately 100 meters) is about the limit of the technology. Therefore, for larger wireless networks and connectivity, another standard was needed. These limitations are one reason municipal wireless networks have largely failed.
WiMAX is a different standard known as the 802.16. It allows only so many users on the standard and then will cut off any additional users trying to use the connection. This is different that WiFi, which will allow, theoretically, a limitless number of users on, which in turn will bog down the system. Despite this, the biggest difference is the range. For non-line of sight, the range is 25 square miles (65 square kilometers). For line of sight between the transmission point and receiving antenna, the range jumps up to 2,800 square miles (9,300 square kilometers).
WiBro is very similar to WiMAX. The transmission speeds are much the same, but the main difference is that WiBro can track a receiver that is moving from place to place. It may also be called mobile WiMAX. However, it is not truly mobile in the sense that it can be used effectively while the receiver is moving at high rates of speed. Rather, it simply means the receiver can move from place to place and experience no degradation in service, as long as the receiver stays within range. WiMAX does not offer this because it needs a stationary antenna in order to receive a signal.
One thing to keep in mind about WiBro is that it is very much still in the developmental process. As it improves, there may come a time when the receivers will be able to maintain connections even while traveling at high rates of speed. In those cases, it may call for a completely different standard altogether with a completely different name.
Mar 02 2009
1. What is the difference between DDR and DDR2?
On the physical side, DDR has a 184-pin DIMM interface and DDR2 has 240.
DDR2 runs cooler and has generally slower timings but is a lot faster than DDR in the end. DDR2 is capable of holding more ram on one DIMM.
2. Does DDR2 do more work per cycle? And Does AMD Support DDR2 Ram?
AMD doesn’t support DDR2 as the A64’s built-in RAM controllers would have to be upgraded therefore making them incompatible with all the current motherboards out there which really wouldn’t be worth AMD and the board manufacturers’ time.
The differences:
• DDr1=184pin DIMM and DDR2=240pin DIMM.
• DDR2 has much higher bandwidth and chip density/# of chips per DIMM, allowing more ram to be effectively used (also the reason why it’s best to go for 1-2gb of DDR2) at a higher speed, but at the expense of latency.
• On the other hand, DDR1 runs at lower speeds but much tighter timings
It is difficult to differentiate a DDR2 from a DDR motherboard just by looking at it. Inserting a DDR2 DIMM into a DDR motherboard could damage the module, the motherboard, or both. To prevent such damage, the simplest process is to align the memory module and the socket, and visually check that the module “key” aligns perfectly with the socket key. You may have to turn over the memory module as the memory module direction may misalign even compatible socket and module keys.
3. What latencies will standard DDR2 DIMMs support?
JEDEC DDR2 specifications define standard DDR2 CAS Latencies of 3, 4, and 5:
– 400 MHz DDR2: CAS 3 (3-3-3)
– 533 MHz DDR2: CAS 4 (4-4-4)
– 667 MHz DDR2: CAS 5 (5-5-5)
4. What latencies do Kingston HyperX DDR2 modules support?
HyperX memory modules support enhanced CAS Latencies:
– 533 MHz PC4300 DDR2: CAS 3 (3-3-3)
– 675 MHz PC5400 DDR2: CAS 4 (4-4-4)
SDRAM – Synchronous Dynamic Random Access Memory
Short for Synchronous DRAM, this is a type of DRAM that synchronizes itself with the CPU’s bus. SDRAM, until recently, was the memory standard for modern PCs. When looking at SDRAM The number following "PC" indicates the speed of the system’s front side bus. (example: The PC100 SDRAM is designed for systems equipped with a 100 MHz front side bus.)
DDR SDRAM – Double Data Rate Synchronous Dynamic Random Access Memory
Short for Double Data Rate-Synchronous DRAM, a type of SDRAM that supports data transfers on both edges of each clock cycle (the rising and falling edges), effectively doubling the memory chip’s data throughput. DDR-SDRAM also consumes less power, which makes it well-suited to notebook computers. DDR-SDRAM is also called SDRAM II. and DDRAM. DDR-SDRAM (and subsequent DD2 and DD3) as well as RDRAM are the technologies which are replacing SDRAM.
DDR2 SDRAM Double Data Rate Two (2) Synchronous Dynamic Random Access Memory
DDR2 SDRAM is the next step up from DDR SDRAM. DDR2 SDRAM offers new features and functions that enable higher clock and data rate operations. DDR2 transfers 64 bits of data twice every clock cycle. DDR2 SDRAM memory is not compatible with current DDR SDRAM memory slots.
DDR3-SDRAM – Double Data Rate Three (3) Synchronous Dynamic Random Access Memory
The third generation of DDR-SDRAM that improves upon DDr2-SDRAM by offering reduced power consumption, a doubled pre-fetch buffer, and also offers more bandwidth because of its increased clock rate.
Feb 24 2009
Every day, new and compelling applications that require considerable graphics horsepower emerge on new computing platforms to enrich our lives. With the NVIDIA Tegra family of computers-on-a-chip, NVIDIA now brings the power of advanced visual computing to a broad range of handheld and mobile platforms—from smartphones, MP3 players, and portable navigation devices (PNDs) to mobile internet devices (MIDs). With system-level design built upon more than 10 generations of proven NVIDIA GeForce technology, Tegra enables intuitive user interfaces, advanced multimedia features, and access to rich online interactivity, all while delivering longer battery life.
The NVIDIA Tegra 600 Series products are the smallest, most advanced, and most highly integrated visual computers-on-a-chip. Featuring unprecedented multimedia functionality—including HD 1080p video and advanced 3D technology—and delivering 10× the power efficiency of competition, Tegra 600 Series products deliver the ultimate visual experience on a broad range of connected devices.
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Tegra 650
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Tegra 600
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Feb 15 2009
The Open System Interconnection (OSI) model was developed in the early 1980’s by the International Organization for Standardization (ISO) with the objective of standardizing communication process in a heterogeneous environment. Each layer was made to independently handle a specific function in the communication process. By independence we mean changes to any of the layers do not necessitate changes to the other layers in the model. This model was however, very vague when it came to specifying the exact details for implementations. It was developed before the protocols for each layer had been fully specified. It was realized later that not all the layers were important. Therefore some of the layers are simply removed or merged with the other layers as in the TCP/IP model which has only 4 layers as compared to the 7 layers in the OSI. The OSI still serves as a good tool for studying the network processes and the protocols associated with each layer.
Let us have a brief look at the layers and their interactions in the TCP/IP protocol suite.
Application Layer: This is the layer through which a user interacts with the network. It consists of various applications like ftp, http, telnet and others. The application layer converts the information into a data stream and sends it to the transport layer. Transport Layer: This layer uses one of the two protocols Transmission Control Protocol (TCP) and User Datagram Protocol (UDP) to determine the way the data has to be sent. TCP breaks the stream into pieces and adds a header to each of the pieces forming a Segment.
The TCP protocol has the following features:
Connection Oriented: It makes uses of handshaking signals to ensure that the other host is ready for communication and that the packet has reached its destination.
Error Detection and Correction: The header contains information, vital for ensuring that the data received is free of errors, is assembled in proper sequence and is complete.
Because of these features, TCP is considered to be a reliable mechanism for transferring data. UDP on the other hand concerns itself only with forwarding the segments and it does not care whether the data has been received at the other end or not. UDP is mainly used for broadcasting messages over a network.
The Internet Layer: It is also known as the network layer and uses Internet Protocol (IP) as its primary protocol. The main function of this layer is to break the segments into smaller packets of sizes that can be handled by the next layer i.e. the network access layer. These packets are called datagram’s. It then encapsulates the datagram with a header. The header contains among other things the source and the destination address, the sequence number of the fragmented segments and Time-To-Live (TTL) to ensure that the packets do not move on the network forever.
Like UDP, IP is unreliable and connectionless. It simply transmits the data to the remote host without knowing whether the host is ready or not to exchange the data. It does not have any error detection/correction facility. The IP does not guarantee the receipt of the datagrams. There is always a possibility that a datagram is lost or corrupted during transmission. The IP forwards the datagram in “as-is” condition to the TCP layer at the receiving end. The TCP then has to make a request for datagrams that are either missing or contain errors.
The network layer uses another protocol called ICMP. The ICMP is used to relay error messages caused due to a variety of situations such as a header failing the integrity test or a header with an expired TTL. One such message is the “host unreachable”, used to inform the non availability of the destination host. This informs the source to not send the packets at this destination.
The Network Access Layer: Also known as the link layer, it mainly consists of network interfaces, device drivers and other physical media and uses ARP (Address Resolution Protocol) as its main protocol. The main function of ARP is to translate an IP addresses to a MAC address and vice versa. A MAC (Medium Access Control) address is the 48-bit hard-wired address of the network card. The link layer then finally sends out the datagram’s in the form of frames to the wire. The advantage of having a separate link layer is that newer physical network technologies can be introduced (such as Frame Relay and ATM added later) without having to modify the higher stacks in the protocol.
A reverse process takes place at the receiving end. At each successively higher layer, the packet is stripped of headers added by the corresponding layer at the sender. The whole communication process can be summarized with the help of the following diagram.
Feb 15 2009
WHAT YOU NEED
First of all, i’d like to say that building a PC is easy. It’s really simple. As simple as pluging things and slotting things into something else.,A philips head screw driver is essiential for obvious reasons, it will be uses a-lot.Most screws will come with the components you buy so no worries there.
THE COMPONENTS
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Computer case |
Monitor
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A Motherboard or main board 
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Processor |
Memory or RAM(Random Access Memory) |
Graphics Card or GPU(Graphical Proccessing Unit)
Sound Card(This IS NOT necessary; optional) 
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Heat Sink Fan |
Power Supply Unit or PSU(Sometimes one comes with the case but you need a good PSU, as it that break it could take out everything it’s connected to which isbasically your whole PC)
CHOOSING YOUR COMPONENTS – COMPATABILITY
This revolves around the motherboard mainly. When choosing your parts you need to make sure they all work together. What you need to really focus on is the CPU and RAM compatability. Just by reading that i don’t think i need to explain the CPU part apart from the MAX BUS SPEED, this is important and you need to make sure your CPU bus speed is faster than your motherboards max bus speed, it can cause crashes.
The RAM part is fairly easy to understand. Obviously don’t put in more RAM than your board can take which is quite easy to find in ANY sites specs details. The type of RAM is a little more tricky. There are different types on ram, DDR, DDR2, DDR3 etc etc, but it goes even deeper than that. How fast the RAM goes is very important to the mobo. As you can see above it says the board supports DDR2, so that means it will support almost any DDR2 RAM you throw at it. If you find things like DDR2 1066/800, This means it will support DDR2 RAM at 1066MHz and 800 MHz, and it will probably support everything below that. The specifications on the RAM’s web page and/or manual will tell you exactly what it is so make sure it’s compatable with your Motherboard.
Graphics cards are easy also. I asume everyone has gone to PCI-E but if they havn’t, check the board supports AGP. And to clear something up, most you know about PCI-E 2.0 graphics cards. THE
Y WILL WORK ON MOTHERBOARDS THAT ONLY SUPPORT PCI-E 1.1 WITH NO LOSS OF FRAME RATE. And make sure you check how big your card is to how big your case is as some cards are rather large. Everything else will be compatable.I will talk about PSU compatability later on.
THE BUILDING
SMPS
Prepare your Case is essential, get to know everything The SMPS will go in first as it’s the messiest bloody component. GET A MODULAR SMPS. They are so much easier. This is an example of a modular SMPS 
The older SMPS just had all the plugs on a SMPS and there were LOTS of left over plugs you didn’t need. With these you plug in the plugs you need and leave it at that So to sum up, put the SMPS in first and screw it into place.
Hard Drive(s) 
This is very simple. As simple as slotting it in and screwing it in. If your using more than one HDD, make sure you put them one slot apart like the ones in the picture. You do this because of heat issues. The HDD will probably be SATA or SATA2, i hope nobody is still going to use IDE on a newly built PC.
DVD Drive(s)
This is also as simple as slotting it in and screwing it in. They usually go right at the top and you have to put it in from the front of the case going inwards.
Motherboard
Be careful taking this out of it’s packaging as it can easily break. This is also as simple as screwing it in one you have the screw hole lined up with the holes in the case. Some motherBoards have a removeable tray, some don’t but having a removable one makes it easier. Line it up with the hole on the motherboard tray and screw it in, it’s as simple as that but it can be tricky.There’s one other thing. Theres a ‘panel’ you get with your motherboard like this. 
Seeing as every motherboard is different you need to unclip the one that comes with your case and clip in the one that came with your motherboard, simple as.
Now your motherboard is in place, you need to start hooking it up. You should already have your PSU in place and attached the cables you need if it’s a modular PSU. First thing you need is the big 24pin. You can’t miss it really. It comes with ANY PSU. Look at the picture below, it’s the one with the black circle around it, simply plug the 24pin from the CPU into the mobo and make sure you put it in the right way, the little clip tells you were. 
Now you need to get the CPU in. You have to be VERY careful with this, if you break the little pins at the bottom which connects it to the mobo, it’s useless. In the picture circled in red, this is where you need to put the CPU, simply flip back the lever, then flip back the second protector, and place it in VERY carfully, if you don’t know which way round to put it have a look at the bottom. THERE IS NO PUSHING IN NEEDED, IT WILL SLOT IN VERY EASILY.
Now the RAM needs to go in, this is very easy. Just pull back the little levers and slot them in. You need to make sure they are going in the right way. In the picture below, the RAM slots are circled red. You will also notice the ram slots are coloured orange and black, if you have two RAM sticks and put them each in a black coloured slot, they will run in dual channel which makes them go faster in some ways.
Now you need to put the Heatsink Fan above the CPU. Most of these fans come with a preapplied layer of thermal paste. If you look at the picture above of the HSF, you will see little clips, it has four of them to be exact and if you look at the motherboard pictures around the CPU, there are four holes, you simply put the clips into the holes on the mobo and turn them so it locks into place.
After that you need to fit the 4pin CPU jumper. Some mobo’s have an 8pin instead of 4pin, so you need to make sure your PSU has an 8 pin. Most will have 4 as standard. Below the 4 pin is circled in red.
SATA CABLES AND POWER.
Now you have your HDD’s and your DVD Drive. IF your DVD drive is IDE, then you need to plug that into the IDE slot on your Mobo, which is next to the 24pin slot. Some new mobo’s don’t have IDE slots. Below is where you should plug your SATA cables to connect your HDD to your motherboard. You get SATA cables(the red cables) with your motherboard when you buy it. You Also need to power them. The other picture is an example of a SATA power plug on your PSU.
*NOTE* YOU NEED TO BE VERY CAREFUL WITH SATA CABLES AS THEY CAN SNAP EASILY.
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FRONT PANEL
I can’t really help you too much with this as it’s just to difficult to explain But it’s you connecting the button that turns on your PC and HDD light to the motherboard. Check your motherboard manual to see where it goes
Graphics card
This is simple to install. You simply slot it into the PCI-E slot and screw it down. Look at the blow picture for examples. FYI a Motherboard can have more than one PCI-E slot.Some Graphics cards need even more power from the PSU, there will be a little plug at the back of the card, either 6 pin or 8 pin or both.
SOUND CARD
This goes in one of the little white slots next to each other in between the PCI-E slots, they are called PCI slots.
FANS
Alot of fans these days use the old IDE HDD power, they are called MOLEX connectors. 
Your HSF will need to be connected to your mobo fan connectors.
Your PC should power up now You need to tidy everything up so your PC has maximum airflow. Plug in your monitor, keyboard and mouse. You need to go into the BIOS by pressing F10 or HOME or something like that(it tells you) at the POST screen and then check that your RAM, CPU, Graphics cards and all that are at the correct speeds, that nothing is to hot and they are all recognized. Then just install your Operating system.
Feb 03 2009
We all use personal computers and we all take them for granted in our everyday lives. It’s easy to forget that PCs have only been around for a couple of decades, and initially were nowhere near the powerhouses we have on our desks today.
For example, did you know that the first “portable” computer weighed 25 kg (55 lb) and cost close to $20,000, that the first laser printer was big enough to fill up most of a room, or that you basically had to build the first Apple computer yourself? This article takes a look at the time when the computer equipment we now take for granted was invented and what it looked like back then.
The first computer mouse
The first computer mouse was invented in 1963 by Douglas Engelbart at the Stanford Research Institute. (He is also one of the inventors of hypertext.) The first mouse used two wheels positioned at a 90-degree angle to each other to keep track of the movement (see picture below). The ball mouse wasn’t invented until 1972, and the optical mouse was invented circa 1980 although it didn’t come to popular use until much later.Douglas Engelbart never received any royalties for his invention and his patent had run out by the time the mouse became commonplace in the era of home PCs.
Above: The first mouse. To the right you can see the wheels it used for movement and positioning.
The first trackball
The trackball was actually invented 11 years BEFORE the mouse, in 1952. It was invented by Tom Cranston and Fred Longstaff as part of a computerized battlefield information system called DATAR, initiated by the Canadian Navy. It used a standard five-pin bowling ball as its trackball, which is smaller than the more common 10-pin bowling ball.
Above: The first trackball, bowling ball and all.
The first portable computer
Well, perhaps that should be “movable” computer… The IBM 5100 Portable Computer was introduced in 1975, weighed 25 kg (55 lb), was the size of a small suitcase and needed external power to operate. It held everything in the same unit, packing in a processor, ROM (several hundreds of KB) and RAM (16-64 KB), a five-inch CRT display, keyboard and a tape drive, which was an amazing feat at the time. It also came with built-in BASIC and/or APL. The different models of the IBM 5100 sold for $8,975 – $19,975.
Above: The IBM 5100 Portable Computer.
The first laptop computer
The first laptop computer (or notebook) was the Grid Compass 1100 (called the GRiD) and was designed in 1979 by a British industrial designer, Bill Moggridge. The computer didn’t start selling until 1982, then featuring a 320×200 screen, an Intel 8086 processor, 340 KB of magnetic bubble memory (a now obsolete, non-volatile memory type) and a 1200 bps modem. It weighed 5 kg (11 lb) and cost $8-10,000. The GRiD was mainly used by NASA and the US military.
Above left: Closeup of the Grid Compass 1100. Above right: NASA astronaut posing with the GRiD in space (that’s Spock on the screen.)
The first IBM PC
The IBM Personal Computer was introduced in 1981 as the IBM 5150. The platform became so pervasive in the 80s that although the term “personal computer” had been in use since the early 70s, a PC became synonymous with an IBM PC-compatible computer.
During its development, the IBM 5150 had been internally referred to as “Project Chess” and was created by a team of 12 people headed by Don Estridge and Larry Potter. To speed up development and cut costs, IBM had decided to use off-the-shelf parts, something that they normally wouldn’t do.
The first IBM PC had an Intel 8088 processor, 64 KB of RAM (extendible to 256 KB), a floppy disk drive (which could be used to boot the computer with a rebranded version of MS-DOS (PC-DOS)) and a CGA or monochrome video card. The machine also had a version of Microsoft BASIC in ROM. On the first IBM PC the optional 10 MB hard disk drive could only be installed if the original power supply was replaced (the original one was too weak).
Above: The first IBM Personal Computer, the IBM 5150.
The first Apple computer
The first Apple personal computers (Apple I) were designed and hand-built by Steve Wozniak. The Apple I went on sale in 1976 for the price of $666.66. Only about 200 units were produced. The Apple I was basically just a motherboard with a processor, a total of 8KB of RAM, a display interface and some additional functionality. To have a working computer, the buyer would have to add a power supply, a keyboard and a display (and a case to keep mount it all in).
Above left: An Apple I computer. Above right: This was the Apple I, essentially a motherboard.<
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The first RAM
Arguably the first (writable) random access memory was Magnetic Core Memory (also called Ferrite-Core Memory) and was invented in 1951 as a result of work done by An Wang at Harvard University’s Computation Lab and Jay Forrester at MIT.
Core memory was a family of related technologies that used the magnetic properties of materials to give them a similar functionality to transistors. They stored their information using the polarity of tiny, magnetic ceramic rings with wires threaded through them. Unlike today’s RAM, core memory could keep its information even after the power was turned off.
Core memory was common until it was replaced by integrated silicon RAM chips in the 1970s. The “core” in core memory is why a memory dump is called a “core dump” even today.
Above left: Closeup of core memory. Above right: The core memory plane in the picture is 16×16 cm (6.3×6.3 inches), holding 128×128 bits (2048 byte).
The first hard disk drive
The IBM Model 350 Disk File was the first hard disk drive and was part of the IBM 305 RAMAC computer that IBM started delivering in 1956 (mainly intended for business accounting). It had 50 24-inch discs that together could store about 4.4 MB of data. The Model 350 spun at 1200 rpm, had a data transfer rate of 8,800 characters per second and an access time of approximately one second.
Above: The first hard disk drive, IBM Model 350.
The first laser printer
The laser printer was invented by Gary Starkweather at XEROX in 1969. His initial prototype was a modified laser copier where he had disabled the imaging system and introduced a spinning drum with eight mirrored sides. The first commercial implementation of a laser printer didn’t happen until IBM released the IBM model 3800 in 1976. It could pretty much fill up a room on its own.
Above: The IBM 3800, the first commercial laser printer.
The first web server
And since the Web is such an integral part of today’s computer experience, we couldn’t help but include another first: The first web server was a NeXT workstation that Tim Berners-Lee used when he invented the World Wide Web at CERN. The first web page was put online on August 6, 1991.
The computer had a note on it that said, “This machine is a server. DO NOT POWER IT DOWN!!” Understandable, considering that if you had shut it down in the early days you would have shut down the entire WWW.
Above: The web server that powered the first web pages on the WWW. Note the sticker with the warning to not turn it off.It’s amazing how much has happened in the PC industry in just a few decades. Just imagine what things will be like 30-40 years from now…
Jan 29 2009
Samsung has announced the production of the first 4GB DDR3 chip. The new chip is based off of a 50nm process and allows for up to 32GB modules if manufactured in a “Dual-Die” package. Samsung was the first to begin development on a 50nm 2GB DDR3 chip back in September and now offer the broadest line of 50nm DDR3 DRAM (4GB, 2GB, 1GB). The new DDR3 chips come at a time when individuals and corporations are demanding more system memory at a lower power cost.
The 4Gb DDR3 can be produced in 16 gigabyte (GB) registered dual in-line memory modules (RDIMM) for servers, as well as 8GB unbuffered DIMM (UDIMM) for workstations and desktop PCs, and 8GB small outline DIMM (SODIMM) for laptops. By applying dual-die package technology, this new device can deliver modules of up to 32GB – offering twice as much capacity as memory modules based on the previous highest chip density of 2Gb.
Designed to be low-powered, the 4Gb DDR3 DRAM operates at 1.35 volts (V), therein improving its throughput by 20 percent over a 1.5V DDR3. Its maximum speed is 1.6 gigabits per second (Gbps).
In 16GB module configurations, 4Gb DDR3 can consume 40 percent less power than 2Gb DDR3 because of its higher density and because it uses only half the DRAM (32 vs. 64 chips).
With an aggressive conversion to 50nm-class production for higher density DDR3, Samsung intends to remain the clear leader in high-volume/high-performance DRAM.
Jan 07 2009
High-resolution LED-backlit widescreen display with 17 “ Display 1920-by-1200-pixel resolution (133 pixels per inch)/New NVIDIA GeForce 9400M integrated graphics processor/The rigid aluminum keyboard,Precision aluminum. /The new gold standard Body/Multi-Touch trackpad/320GB hard drive / three USB 2.0 ports and a FireWire 800 port / Built-in iSight camera / microphone, and speaker system,Intel Core 2 Duo processor running at up to 2.93GHz based on 45-nm process technology With the 1066MHz frontside bus and 6MB of shared L2 cache,Express Card/34 slot and a 3G wireless card,Up to 8 hrs Battery backup.
With great associates of
